to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics.
the information in this document is subject to change without notice. before usi ng this document, please confirm that this is t he latest version. not all products and/or types are available in ever y country. please check with an nec electronics sales representative for avail ability and additional information. mos field effect transistor 2sk4075b switching n-channel power mos fet data sheet document no. d20258ej1v0ds00 (1st edition) date published march 2010 ns printed in japan description the 2sk4075b is n-channel mos fet desi gned for high current switching applications. ordering information part number lead plating packing package 2SK4075B-ZK-E1-AY 2sk4075b-zk-e2-ay pure sn (tin) tape 2500 p/reel to-252 (mp-3zk) typ. 0.27 g features ? low on-state resistance r ds(on)1 = 7.9 m max. (v gs = 10 v, i d = 25 a) r ds(on)2 = 10 m max. (v gs = 4.5 v, i d = 13 a) ? low c iss : c iss = 2230 pf typ. ? logic level drive type absolute maximum ratings (t a = 25c) drain to source voltage (v gs = 0 v) v dss 40 v gate to source voltage (v ds = 0 v) v gss 20 v drain current (dc) (t c = 25c) i d(dc) 50 a drain current (pulse) note1 i d(pulse) 120 a total power dissipation (t c = 25c) p t1 36 w total power dissipation (t a = 25c) p t2 1.0 w channel temperature t ch 150 c storage temperature t stg ?55 to +150 c single avalanche current note2 i as 20.8 a single avalanche energy note2 e as 43 mj notes 1. pw 10 s, duty cycle 1% 2. starting t ch = 25c, v dd = 20 v, r g = 25 , v gs = 20 0 v, l = 100 h thermal resistance channel to case thermal resistance r th(ch-c) 3.47 c/w channel to ambient thermal resistance r th(ch-a) 125 c/w (to-252) 2010
data sheet d20258ej1v0ds 2 2sk4075b electrical characteristics (t a = 25c) characteristics symbol test conditions min. typ. max. unit zero gate voltage drain current i dss v ds = 40 v, v gs = 0 v 1 a gate leakage current i gss v gs = 20 v, v ds = 0 v 100 na gate cut-off voltage v gs(off) v ds = 10 v, i d = 1 ma 1.5 2.0 2.5 v forward transfer admittance note | y fs | v ds = 10 v, i d = 13 a 7.0 s drain to source on-state resistance note r ds(on)1 v gs = 10 v, i d = 25 a 5.9 7.9 m r ds(on)2 v gs = 4.5 v, i d = 13 a 7.5 10 m input capacitance c iss v ds = 10 v 2230 pf output capacitance c oss v gs = 0 v 319 pf reverse transfer capacitance c rss f = 1 mhz 171 pf turn-on delay time t d(on) v dd = 20 v 15 ns rise time t r i d = 25 a 17 ns turn-off delay time t d(off) v gs = 10 v 51 ns fall time t f r g = 0 5 ns total gate charge q g v dd = 32 v 44 nc gate to source charge q gs v gs = 10 v 8 nc gate to drain charge q gd i d = 50 a 12 nc body diode forward voltage note v f(s-d) i f = 50 a, v gs = 0 v 0.9 1.5 v reverse recovery time t rr i f = 50 a, v gs = 0 v 30 ns reverse recovery charge q rr di/dt = 100 a/ s 25 nc note pulsed test circuit 3 gate charge v gs = 20 0 v pg. r g = 25 50 d.u.t. l v dd test circuit 1 avalanche capability pg. d.u.t. r l v dd test circuit 2 switching time r g pg. i g = 2 ma 50 d.u.t. r l v dd i d v dd i as v ds bv dss starting t ch v gs 0 = 1 s duty cycle 1% v gs wave form v ds wave form v gs v ds 10% 0 0 90% 90% 90% v gs v ds t on t off t d(on) t r t d(off) t f 10% 10%
data sheet d20258ej1v0ds 3 2sk4075b typical characteristics (t a = 25c) derating factor of forward bias safe operating area total power dissipation vs. case temperature dt - percentage of rated power - % 0 20 40 60 80 100 0 25 50 75 100 125 150 175 t c - case temperature - c p t - total power dissipation - w 0 5 10 15 20 25 30 35 40 0 25 50 75 100 125 150 175 t c - case temperature - c forward bias safe operating area i d - drain current - a 0.1 1 10 100 1000 0.1 1 10 100 i d(dc) i d(pulse) r d s ( o n ) l i m 1 i t e d ( v g s = 1 0 v ) t c = 2 5 c sing le puls e p o w e r d i s s i p a t i o n l i m 1 i t e d p w = 1 m 1 s 1 1 0 m 1 s v ds - drain to source voltage - v transient thermal resistance vs. pulse width r th(t) - transient thermal resistance - c/w 0.1 1 10 100 1000 single pulse r th(ch-a) = 125 c/w r th(ch-c) = 3.47 c/w pw - pulse width - s 1 m 10 m 100 m 1 10 100 1000
data sheet d20258ej1v0ds 4 2sk4075b drain current vs. drain to source voltage forward transfer characteristics i d - drain current - a 0 20 40 60 80 100 120 140 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 v gs = 10 v 4.5 v pu ls e d v ds - drain to source voltage - v i d - drain current - a 0.001 0.01 0.1 1 10 100 11.522.533.54 v ds = 10 v pu ls e d t ch = 150c 125c 75c 25c -25c -55c v gs - gate to source voltage - v gate cut-off voltage vs. channel temperature forward transfer admittance vs. drain current v gs(off) - gate cut-off voltage - v 0 0.5 1 1.5 2 2.5 3 -100 -50 0 50 100 150 200 v ds = 10 v i d = 1 m 1 a t ch - channel temperature - c | y fs | - forward transfer admittance - s 0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100 v ds = 10 v pulsed t ch = 150c 25c -25c 125c 75c -55c i d - drain current - a drain to source on-state resistance vs. drain current drain to source on-stateresistance vs. gate to source voltage r ds(on) - drain to source on-state resistance - m 0 5 10 15 0.1 1 10 100 1000 pu ls e d v gs = 4.5 v 10 v i d - drain current - a r ds(on) - drain to source on-state resistance - m 0 5 10 15 0 5 10 15 20 pu ls e d i d = 13 a 25 a 50 a v gs - gate to source voltage - v
data sheet d20258ej1v0ds 5 2sk4075b drain to source on-state resistance vs. channel temperature capacitance vs. drain to source voltage r ds(on) - drain to source on-state resistance - m 0 2 4 6 8 10 12 14 -100 -50 0 50 100 150 200 i d = 25 a, v gs = 10 v pu ls e d i d = 13 a, v gs = 4.5 v t ch - channel temperature - c c iss , c oss , c rss - capacitance - pf 10 100 1000 10000 0.01 0.1 1 10 100 v gs = 0 v f = 1 mhz c iss c oss c rs s v ds - drain to source voltage - v switching characteristics dyna mic input/output characteristics t d(on) , t r , t d(off) , t f - switching time - ns 1 10 100 1000 0.1 1 10 100 v dd = 20 v v gs = 10 v r g = 0 t d(of f ) t r t d(on) t f i d - drain current - a v ds - drain to source voltage - v 0 10 20 30 40 50 0 1020304050 0 2 4 6 8 10 i d = 50 a pu ls e d v gs v ds v dd = 32 v 20 v 8 v q g - gate chage - nc v gs - gate to source voltage - v source to drain diode forward voltage reverse recovery time vs. diode forward current i f - diode forward current - a 0.01 0.1 1 10 100 1000 00.51 pu ls e d v gs = 10 v 4.5 v 0 v v f(s-d) - source to drain voltage - v t rr - reverse recovery time - ns 1 10 100 0.1 1 10 100 di/dt = 100 a/ s v gs = 0 v i f ? diode forward current - a
data sheet d20258ej1v0ds 6 2sk4075b package drawing (unit: mm) to-252 (mp-3zk) 6.5 0.2 2.3 0.1 0.5 0.1 0.76 0.12 0 to 0.25 0.5 0.1 1.0 no plating no plating 5.1 typ. 1.0 typ. 6.1 0.2 0.51 min. 4.0 min . 0.8 10.4 max. (9.8 typ.) 4.3 min. 1 4 23 1.14 max. 2.3 2.3 1. gate 2. drain 3. source 4. fin (drain) equivalent circuit source body diode gate drain remark the diode connected between the gate and source of t he transistor serves as a protector against esd. when this device actually used, an addi tional protection circuit is exter nally required if a voltage exceeding the rated voltage may be applied to this device.
data sheet d20258ej1v0ds 7 2sk4075b tape information there are two types (-e1, -e2) of t aping depending on the direct ion of the device. reel side draw-out side marking information pb-free plating marking k4075b abbreviation of part number lot code recommended soldering conditions the 2sk4075b should be soldered and mount ed under the following recommended conditions. for soldering methods and conditions other than t hose recommended below, please contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http:// www.necel.com/pkg/en/m ount/index.html) soldering method soldering conditions recommended condition symbol infrared reflow maximum temperature (pack age's surface temperature): 260c or below time at maximum temperature: 10 seconds or less time of temperature higher than 220c: 60 seconds or less preheating time at 160 to 180c: 60 to 120 seconds maximum number of reflow processes: 3 times maximum chlorine content of rosin fl ux (percentage mass): 0.2% or less ir60-00-3 partial heating maximum temperature (pin temperature): 350c or below time (per side of the device): 3 seconds or less maximum chlorine content of rosin flux: 0.2% (wt.) or less p350 caution do not use different soldering me thods together (except for partial heating).
2sk4075b ? the information in this document is current as of march, 2010. the information is subject to change without notice. for act ual design-in, refer to the latest publicati ons of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electroni cs products. not all products and/or types are ava ilable in every country. please check with a n nec electronics sales representative for av ailability and additional information. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility fo r any errors that may appear in this document. ? nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights o f third parties by or arising from the use of nec electronics products listed in this document or any other liability arising fro m the use of such products. no license, express, implied or other wise, is granted under any patents, copyrights or other intellectua l property rights of nec electronics or others. ? descriptions of circuits, software and other related informati on in this document are provi ded for illustrative purposes in semiconductor product operation and application examples. the incorporation of thes e circuits, software and information in the design of a customer's equipment shall be done under the fu ll responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. ? while nec electronics endeavors to enhance the quality, reliab ility and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons ar ising from defects in nec electronics produc ts, customers must incorporate sufficient safety measures in their design, such as redundanc y, fire-containment and anti-failure features. ? nec electronics products are classified into the following th ree quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a cu stomer-designated "quality assurance program" for a specific application. the re commended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electroni cs product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurem ent equipment, audio and visual equipment, home electronic appliances, ma chine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti- crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospac e equipment, submersible repeaters, nuclear reac tor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expre ssly specified in nec electronics data sheets or data books, etc. if customers wish to use ne c electronics products in applic ations not intended by nec electronics, they must contact an nec electronics sales repr esentative in advance to deter mine nec electronics' willingness to support a given application. (note 1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority- owned subsidiaries. (note 2) "nec electronics products" m eans any product developed or manufactured by or for nec electronics (as defined above). (m8e0909e)
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